| 摘要 |
<p>An improved test apparatus (10) for testing leadless IC chip carriers (60) or IC dies. The apparatus employs a flexible film (50) on which is imprinted a conductor line pattern (54, 55) terminated in a plurality of raised conductive pads (52). The line pattern (54, 55) is readily formed on the film surface (50e) using photolithographic techniques. The conductive pads (52) are arranged on the film surface (50e) in such a way as to conform to the positioning of the edge contact terminals (61) of the chip carrier (60). A frame structure (25, 30) is provided for resiliently urging the chip carrier (60) against the surface (50e) of the film (50), with the edge terminals (61) of the chip carrier (60) in electrical contact with the raised pads (52) on the film (50). The conductor lines (54, 55) on the film (50) are also terminated in raised pads (47), which are urged against a printed wire pattern (46) on a rigid circuit board (45), which provides connections to the chip carrier test equipment. Thus, electrical contact is made to the chip carrier (60) without the use of wire bonds or solder connections.</p> |
