发明名称 BONDING METHOD AND DEVICE THEREFOR
摘要 PURPOSE:To reduce the generation of defective bonding by a method wherein the surface of a metal wire is exposed by removing the insulating material on the bonding part of a covered wire using the flame of burning mixed gas, and the insulating material of the covered wire is removed completely. CONSTITUTION:The covered wire 2, consisting of a metal wire which is covered by an insulating material, is connected to a bonding part. At that time, the mixed gas of combustion gas and temperature controlling gas to be used to lower the burning temperature of the combustion gas is formed. The insulating material on the bonding part of the wire 2 is removed by jetting out the burning flame generated by burning the combustion gas from an insulating material removing torch 15, and the surface of the metal wire at the bonding part of the wire 2 is exposed. The metal wire of the exposed wire 2 is connected to the bonding part. As a result, the burning flame giving no damage or breakage can be engulfed substantially on the whole area of the bonding part of the wire 2. Consequently, the insulating material of the wire 2 can be removed completely, and the generation of unsatisfactory bonding can be reduced.
申请公布号 JPS63182828(A) 申请公布日期 1988.07.28
申请号 JP19870014035 申请日期 1987.01.26
申请人 HITACHI LTD 发明人 OKIKAWA SUSUMU;TANIMOTO MICHIO
分类号 H01L21/60 主分类号 H01L21/60
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