| 摘要 |
PURPOSE:To unnecessitate both an expensive dielectric and an earthing conductor by a method wherein the electrode on the surface to be earthed of a transistor chip is led out to the rear surface through a penetrated part, connected to the rear electrode, and the rear electrode is directly attached to the earthing conductor. CONSTITUTION:The electrode 3 on the surface to be earthed of a transistor chip 1 is led out to the rear surface through the intermediary of a penetrated part 17, connected to a rear electrode 5, and the rear electrode 5 is directly attached to an earthing conductor. As a result, the collector electrode 4 on the rear surface of the transistor chip is led out to the surface of the transistor chip in the same manner as applied to the ordinary IC, the output of the surface to be earthed is led out to the rear surface through a penetrated part 17 and connected to the rear electrode 5. By attaching the rear electrode 5 directly to the earthing conductor, the earthing conductor is unnecessitated, the inductance for earthing can be made very small, and thermal resistivity can be made small without using an expensive dielectric. |
