CORRECTING METHOD OF POSITION OF MOUNT FOR IC MOUNTING DEVICE

摘要

PURPOSE:To conduct correction having high precision without damaging an IC by reading a characteristic article in a substrate internal pattern and a bump for an IC joint surface by a picture processor for detecting positional displacement and computing the quantity of the correction of the position of a mount. CONSTITUTION:A characteristic article 13 in an internal pattern in a substrate 8 on a carrying rail 5 is read by a picture processor 3 for detecting the positional displacement of the substrate. Bumps 15 arranged onto the joint surface of an IC 9 are read by a picture processor 6 for detecting the positional displacement of the IC. The information of the positional displacement of the substrate and the positional displacement of the IC acquired by these processors 3 and 6 is transmitted over a controller 7 for an IC mounting device. The controller 7 receives the information of both positional displacement, arithmetically operates the information, and transmits the command of movement by an IC-mount position correction value over the IC mounting device 1. The device 1 receives the command of movement, and mounts the IC 9 picked up by the device 1 to the substrate 8. Since the device is not brought into contact with the external shape of the IC 9, the IC 9 is not damaged. The position of the mount can be corrected with high accuracy.