发明名称 SOLDERING APPARATUS
摘要 Appts. for soldering a printing circuit board comprises a vessel for contg. molten solder, an upwardly extending riser in communication with the vessel and having several ports for overflowing molten solder arranged along the riser so as to be transversely of the transfer path of a printed circuit board. The ports are movable so that the board is contacted with a progressive wave of molten solder overflowing from the moving parts.
申请公布号 DE3472066(D1) 申请公布日期 1988.07.21
申请号 DE19843472066 申请日期 1984.04.17
申请人 NIHON DENNETSU KEIKI CO., LTD. 发明人 KONDO, KENSHI C/O NIHON DENNETSU KEIKI CO., LTD.
分类号 B23K3/06;(IPC1-7):B23K1/08;H05K3/34 主分类号 B23K3/06
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