| 摘要 |
PURPOSE:To prevent the deterioration of the surge protection function due to the microscopic formation of a wafer process by a method wherein a surge protection element is not formed on the same substrate as an integrated circuit in a wafer process, but the surge protection element is attached to the package of the integrated circuit. CONSTITUTION:A lead frame 1 and the lead frame 5 of an earthing wire are connected by inserting elements 6 having Zener effect between each lead frame 1, to be connected to the chip 3 of an integrated circuit with an inner lead 2 and the lead frame 5, At this point, the surge protection element consisting of the element 6 having Zener effect is attached to the package of a semiconductor integrated circuit. As said surge protection element is isolated from the substrate of the integrated circuit, the surge protection function of the device is not influenced by the wafer process. As a result, the package itself performs a surge protection function, the lowering of the surge protection function of the semiconductor integrated circuit due to the influence of the microscopic formation of the wafer treatment process can be prevented, and the degree of integration of the integrated circuit can also be improved.
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