| 摘要 |
PURPOSE:To directly analyze the compsn. distribution of the metal and nonmetal at the boundary face of a thin film by stripping the thin film formed on a substrate from the substrate. CONSTITUTION:Gold is formed on the surface of the thin film in direct contact with the plastic substrate 1 by a sputtering method to form a protective film 3. An epoxy adhesive agent is coated as a lining material layer 4 in the case of stripping the thin film from the substrate on the protective film 3 by using a brush. After the adhesive agent data sets completely, the test piece consisting of such epoxy adhesive agent, the protective to prepare a test piece for compsn. analysis by an AES method. The thin film is the film contg. the metal and nonmetal of four elements shown by B, C, D, E.
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