| 摘要 |
PURPOSE:To inspect a groove in a substrate surface in a nondestructive manner by reflected beams from an inspection mark section regardless of a groove in a principal region by previously forming the groove with specific density proper for inspection by utilizing a non-principal region on a substrate and using the groove as the inspection mark. CONSTITUTION:A region such as a scribing region 23 for dividing a wafer into each chip is utilized, avoiding a principal region for manufacturing an integrated circuit on the surface of the semiconductor wafer regarding a groove as an inspection mark. An inspection mark 24 is designed in size close to the opening diameters and opening width of fine grooves manufactured in the principal region. Patterns such as strip-shaped or square ones are selected as patterns formed in an inspection mark region in response to grooves having various shapes shaped to the integrated circuit. The width S1 of the grooves is brought to size approximately the same as that of the grooves employed for the integrated circuit on the strip-shaped inspection marks, and distances L1 among adjacent grooves are designed in L1=k1S1 and k1=1.0-2.0, 15-50% density, thus allowing the observation of the fine grooves.
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