发明名称 |
INTERCONNECTION OF ELECTRONIC COMPONENTS |
摘要 |
A technique for interconnecting electronic components in which interconnection wires (7) are bonded to contacts (3) on a first component (1) without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts (23) on the second component (21) by means of a conductive material (27) such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulating matérial. The invention also provides a bonding head for a wire bonder for bonding the wire to the contact on the first component and for weakening or severing the wire at the desired point. |
申请公布号 |
WO8804829(A1) |
申请公布日期 |
1988.06.30 |
申请号 |
WO1987US03360 |
申请日期 |
1987.12.17 |
申请人 |
RAYCHEM CORPORATION |
发明人 |
CARLOMAGNO, WILLIAM, DOMINIC;CUMMINGS, DENNIS, EDWARDS;GLIGA, ALEXANDRU, STEPHEN |
分类号 |
B23K20/00;H01L21/00;H01L21/60;H01L21/603 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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