| 摘要 |
Hardening solvent, based on dicyandiamide, for epoxy resins comprises (a) 50-90 pts. by wt. dimethylformamide (DMF), (b) 5-50 pts. by wt. of a low b.pt. ketone and/or alcohol, (c) 5-30 pts. by wt. dicyandiamide based on the sum of (a)+(b). Pref. the ketone is acetone and/or methyl ethyl ketone and the low-boiling alcohol is methanol and/or ethanol and/or 1-methoxy-2-propanol. 1-10, pref. 2-5,wt.% based on dicyandiamide, of a hardening accelerator is present. Hardening solns. as claimed are used for the prepn. of storage-stable epoxy resin solns. contg. 1-10wt.% dicyandiamide. |
