| 摘要 |
PURPOSE:To contrive to perform simply the respective inspections of a tinning treatment and a solder treatment even in case the sheathing treatment at the lead parts of an electronic part is the tinning treatment or the solder treatment by a method wherein the position of an optical system, which is an inspecting means, is changed- over according to the kind of the sheathing treatment at the lead parts of the electronic part. CONSTITUTION:A fourth inspecting part 27 consists of illumination part 61 and 62 to be constituted by straight pipe fluorescent lamps, a mirror 64 for shading prevention, a mirror 65 to guide a reflected light from an IC 1 to a rear stage, a mirror driving part 66 to make the mirror 65 rotate and an image sensing part 67 to be constituted by a CCD camera 65 which converts a signal in every one scanning line to be guided from the above mirror 65 into an electrical signal. In this case, whether the above fourth inspecting part 27 is used in specular reflection or is used in diffuse reflection is so contrived as to be modified by the movement of the mirror 65, the mirror driving part 66 and the image sensing part 67 and a difference between the illumination parts 62 and 61 to be lighted and in case the sheathing treatment at the lead parts 1a of the IC 1 is a tinning treatment, the diffuse reflection is used and in the case of a solder treatment, the specular reflection is so contrived as to be used.
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