| 摘要 |
PURPOSE:To output a stable SSCAN signal by providing a resin molding which covers a photosensor chip to which anode or cathode is connected to wiring on a substrate through a wire and the substrate only at necessary parts for wire protection. CONSTITUTION:The output terminal of the anode or cathode of the photosensor chip 21 is connected to the wiring 24 on the substrate 22, but the other output terminal is connected to different wiring 26 on the substrate through a bonding wire 25 from the tip surface of the chip 21. Then only a bonding wire 26 which is easiest to break in the photosensor 10 is coated with the transparent resin molding 27 for protection. At this time, the molding 27 covers the periphery of the bonding wire connection part of the chip 21 and the bonding wire 25. Consequently, a light beam scanning line 23 does not passes through the transparent resin molding 27 and unnecessary incidence due to the refraction of the transparent resin molding 27 of a chip side, so that the accurate SSCAN signal 3 is obtained.
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