发明名称 REMOVING DEVICE FOR SUBSTRATE
摘要 PURPOSE:To extract a substrate positively and automatically without damaging the substrate and a conductor pin implanted to the substrate by arranging an extruding jig with an extruding pin corresponding to a pin inserting hole for a pallet and upwardly moving the extruding jig in at least two stages. CONSTITUTION:Extruding pins 31 for an extruding jig 30 on a susceptor 21 are inserted into each pin inserting hole H of a corresponding pallet P by upwardly moving the susceptor 21 disposed to the lower section of a carrying path 210 by a working mechanism 20, and substrates 51 on the pallet P are pushed up slightly. The side section of the substrate 51 under the state in which the substrate is levilated a little from the upper section of the pallet P is held by an extracting arm 41 for an extracting mechanism 40, and the substrate 51 is lifted upward as it is and shifted onto an external carrying path 220, thus automatically taking out the substrate 51, to which a large number of conductor pins 52 are implanted, positively to the outside of a device.
申请公布号 JPS63136551(A) 申请公布日期 1988.06.08
申请号 JP19860282604 申请日期 1986.11.27
申请人 IBIDEN CO LTD 发明人 TAKAHASHI TSUNEHISA;IWATA TAKASHI;TAKAHASHI KATSUHIRO;SEKIYA MASATAKA
分类号 H01L23/32;H05K3/46 主分类号 H01L23/32
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