| 摘要 |
PURPOSE:To detect plural pieces simultaneously at a high speed by comparing a two-dimensional infrared ray image sensor signal for measuring a surface temperature distribution of a semiconductor element and a reference pattern generating device signal for generating a signal corresponding to a prescribed temperature distribution. CONSTITUTION:When power is supplied through a power supply plate, a semiconductor element is heated and infrared rays are generated from its inside. This infrared rays are detected by a two-dimensional infrared rays image sensor 2. An output signal of the sensor 2 is compared with an output signal of a reference pattern generating device 3 for generating a series of electric signals corresponding to a prescribed temperature distribution. When a lower part than a prescribed temperature is erased and only a high temperature part is displayed in accordance with a surface temperature distribution of each semiconductor element which semiconductor element is a failure can be known.
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