| 摘要 |
PURPOSE:To inhibit the drawing of a copper foil wiring forming a circuit minimally, and to improve the degree of integration by a method wherein an active element and a passive element are loaded onto a circuit substrate stuck onto a metallic lead frame, the active element and the passive element are connected by a metallic small-gage wire, copper foil, etc., and the circuit is shaped, used as sheathing and sealed with a resin. CONSTITUTION:An insulating circuit substrate 3 is bonded onto a metallic lead frame 1 by adhesives 2, and a copper foil wiring 4 and a resistor 5 are formed to the circuit substrate 3. An active element or a passive element 7 is loaded onto the circuit substrate 3, connected by a metallic small-gage wire, and sealed with a resin 9 through a transfer mold sealing method. Accordingly, the degree of integration can be improved by the reduction of the drawing of a circuit, and the moisture-resistant characteristics of the resistor shaped onto the circuit substrate can also be ensured.
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