<p>A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.</p>
申请公布号
EP0268230(A2)
申请公布日期
1988.05.25
申请号
EP19870116794
申请日期
1987.11.13
申请人
AIR PRODUCTS AND CHEMICALS, INC.
发明人
BERTIN, ROBERT;MILLER, MICHAEL B.;MOON, BURL M.;POST, ROBERT C.
