| 摘要 |
PURPOSE:To make it possible to apply photoresist uniformly in a plane without fluctuation in thickness of a film, by setting atmosphere in a cup immediately before application at constant conditions, and making the pressure of an exhaust gas in treatment adequate. CONSTITUTION:A remaining solvent in application treatment immediately before is purged with a powerful exhaust gas. Thereafter the exhaust gas is stopped. Then a specified amount of vapor of solvent at a constant temperature is discharged, and the humidity of an environment is kept under constant conditions. Thereafter photoresist is dropped on a wafer 7. A spin motor 1 is rotated under an adequate exhaust gas pressure. Thus the photoresist is spread in a thin film state. In this way, the same conditions are set for every application treatment for each wafer 7. Namely, the atmosphere in the vicinity of a cup 3 is always kept under the same state. Furthermore, the adequate exasust gas pressure is set at the time of application. Thus the application can be performed uniformly in the plane without fluctuation in film thickness.
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