| 摘要 |
PURPOSE:To bond predetermined number of wirings even if a connecting pad is extremely reduced upon enhancement of a density by bonding repairing wirings, then stacking next repairing wirings on the previously bonded wirings and bonding them. CONSTITUTION:When a connecting pad does not have a sufficient size to bond a plurality of repairing wirings aligned on a flat surface, first repairing wirings 2 are bonded on the pad 1, and second and third repairing wirings 3, 4 are stacked thereon to be connected. Thus, when repairing wirings 2 are wired on a multilayer module substrate 15, the wirings 3 can be stacked to be connected to the pad 1 having a limited size. Thus, a plurality of predetermined repairing wirings 3 can be connected to cope with a circuit revision. |
