DEVICE AND METHOD FOR EVENING OUT THE THICKNESS OF METAL LAYERS ON ELECTRICAL CONTACT POINTS ON ITEMS THAT ARE TO BE TREATED

摘要

The invention relates to a device and method for evening out the thickness of metal layers on electrical contact points on items to be treated (7), such as conductor foil and printed circuit boards, during electrolytic treatment thereof whereby said items are guided on a horizontal plane of conveyance in a continuous electroplating plant. The device comprises two counter electrodes (2,3) located opposite said plane of conveyance and clamps (4) secured to a continuously revolving means of conveyance (5) for contacting the items to be treated (7). The clamps have an electroconductive lower part (14) and upper part (15) with a surface consisting of metal. Both parts can move in relation to each other and have at least one contact point for the items to be treated (7). At least one power source is also provided to produce a current flow between the counter electrodes and the items to be treated. In order to avoid a pirate cathode effect in the contact clamps (4) during electrolytic metallization, upper and lower shields (15,16) for the electric field are arranged between the anodes (2,3) and the clamps (4). Said shields extend so closely to the plane of conveyance that the items to be treated (7) which are guided on said plane and the clamp parts (13,14) do not to come into contact with the shields.