发明名称 LOW MELTING-POINT SOLDER ALLOY
摘要 PURPOSE:To perform the soldering with excellent solderability even in a low temp. and high reliability by specifying the compsn. of a solder and making the ratio of the compsn. in a prescribed compsn. range. CONSTITUTION:The titled quaternary solder consists of, by wt., 40-70% Sn, 2-15% Bi, 5-15% In and the balance Pb with a melting point in the range of 100-160 C. Even electronic parts with inferior heat resistance can be soldered collectively by a dip system or a flow system and productivity and workability can be enhanced by forming such a compsn.
申请公布号 JPS63112092(A) 申请公布日期 1988.05.17
申请号 JP19860257480 申请日期 1986.10.29
申请人 SONY CORP 发明人 IIDA HIROYUKI
分类号 B23K35/24;B23K35/26;C22C11/00;C22C13/00 主分类号 B23K35/24
代理机构 代理人
主权项
地址