| 摘要 |
PURPOSE:To enable fine machining and reliable electrical joint, by galvanizing the surface of metallic material into a predetermined pattern with such metal as having high solder wetting performance, then etching the galvanized surface while employing the galvanized pattern as a mask. CONSTITUTION:A tungsten foil 4 is applied onto a substrate 2 so as to prepare a head substrate. Then the surface of tungsten 2 is etched and washed, thereafter a mask 6 of desired pattern is formed through a negative photoresist. Thereafter, it is slightly galvanized with chromium followed by nickel galvanization 8. Since the negative pattern mask 6 exists on the head substrate, the nickel galvanization 8 is formed on the tungsten 4 with a desired positive pattern. Finally, it is etched with tungsten etching liquid. Consequently, the nickel galvanized 8 portion is not eroded and a fine tungsten pattern can be formed easily. Furthermore, since the nickel galvanized portion 8 is exposed, wetting performance with solder is improved, resulting in the improvement of strength at the soldered portion. |
