发明名称 POLISHING DEVICE
摘要 PURPOSE:To enable a device to efficiently perform polishing using polishing tapes of large width, by providing a means, which pressurizes a back surface of the polishing tape with desired distribution, and performing the polishing to be controlled so that its speed obtains a desired value. CONSTITUTION:Polishing tapes 2, 12, wound by winding mechanisms 5, 15, are arranged on a picture of a magnetic disc 1, which is a work, further held by pressurizing parts 3, 13. These pressurizing parts 3, 13, providing two rows of three throttle holes 32 to be drilled over the magnetic disc 1 from its internal peripheral p[arts Ri to peripheral part Ro, form a pressurizing chamber 31 on a surface brought into contact with the polishing tapes 2, 12 in the bottom end of said holes, and a polishing device, which respectively introduces fluid pressures P1-P6 suitably set by a pressurizing force regulating system 4, uniformly presses the polishing tapes 2, 12 to the magnetic tape 1. Under this condition, the device, rotating the magnetic disc 1 in a desired rotary speed, performs polishing. In this way, a surface of optional shape of the work can be efficiently further high accurately polished by using the polishing tape of large width.
申请公布号 JPS6399170(A) 申请公布日期 1988.04.30
申请号 JP19860242925 申请日期 1986.10.15
申请人 HITACHI LTD 发明人 KAWAMURA YOSHIO;KAWAKUBO YOICHI;KANETOMO MASABUMI;MORITA KENJI;KATO SHIGEO;FUMIOKA JIYUN;ITO YASUSHI
分类号 B24B21/00 主分类号 B24B21/00
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