WAFER-SCALE INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE: To simplify the assembly of a complete device or system by using a silicon wafer by including a semiconductor wafer having an electronic circuit and a plurality of contacts electrically connected with this. CONSTITUTION: First and second full wafer scale semiconductor integrated wafers 10 and 11 are provided on both surfaces of almost a flat the thermal conductive base member 12. The base member 12 is made of a non-metallic thermal conductive materials, and it functions as a support structure for the wafers and a also it acts as a heat sink for releasing the heat generated in operation. The wafers area fixed to the base member with an elastic adhesive film for reducing any stress generated at those semiconductor wafers 10 and 11 owing to a little thermal expansion coefficient between the wafers and the base member. Such typical wafer scale semiconductor wafers 10 and 11 include an electronic circuit fixed at a plurality of sites for executing an electronic function, and a plurality of contacts 18 used for signal continuity with the wafer. Thus, the operating speed and reliability of the device can be improved by operating wafer scale integration.