| 摘要 |
PURPOSE:To solve a problem on limitation for the position of alignment marks, by installing auxiliary radiation parts for resist pre-bleaching so that either one of them is selected face field exposure irradiation parts in order to obtain changing irradiation. CONSTITUTION:Auxiliary radiating parts 25 are installed on both sides of a field exposure part and in the direction in which an irradiated wafer is moved. Positions of the radiating parts 25 become adjustable in the X and Y axis directions so that irradiated positions of the exposure field can be set desirable. Alignment and exposure on a field A are performed by a field exposure device 21. Simultaneously spot irradiation for a wafer alignment mark on a field B is performed by the use of the radiating part 25. Namely, pre-bleaching of a resist on the alignment mark on the field B is completed during the processing of the field A. Hence, a problem on Iimitation for the position of the alignment marks can be solved. |
