METHOD OF PRODUCING CONDUCTOR CIRCUIT BOARDS.

摘要

The circuit board conductor production method uses a thin metal layer formed by electrolysis, maintaining a thickness of 1 to 5 micro-metres on an electrically conductive single-plate substrate having a predetermined coarseness, a resist mask is formed on the surface of the thin metal layer, and then a conductor circuit is electroformed using copper. After the surface of the conductor circuit is coarsened, the conductor circuit is laminated on an insulating substrate for each single plate via the thin metal layer and is intimately adhered in a unitary structure by the application of heat and pressure. Then, the single plate only is peeled off, and the exposed thin metal layer is removed by etching. The thin metal layer and the conductor circuit are electroplated at high speeds under the conditions of a liquid contact speed of 2.6-20m/sec. and a current density of 0.15-4.00A per square cm, so that a required intimate adhesion force is obtained between the thin metal layer and the resist mask. The conductor circuit is provided with flexibility like that of rolled and annealed copper.