| 摘要 |
PURPOSE:To decrease the thickness of a pacage and to facilitate the manufacture, by pushing down and machining a die bonding part and a suspending lead part for a conductor interconnection, accommodating these parts in holes in an insulating substrate, and mounting a semiconductor chip on the die bonding part. CONSTITUTION:A circuit substrate 3 is constituted of an insulating substrate 5 and a conductor interconnection 8 formed thereon. A die bonding part 8a, on which a semiconductor chip 2 is mounted, and a suspending lead part 8b, which supports the part 8a, are formed in the conductor interconnection 8. Holes 6 and 7, which have about the same size as those of the die bonding part 8a and the suspending lead part 8b, are provided in the insulating substrate 5. The die bonding part 8a and the suspending lead part 8b are pushed down, machined and accommodated in the holes 6 and 7. The semiconductor chip 2 is mounted on the die bonding part 8a. For example, the conductor interconnection 8 comprising a copper foil is stuck to the insulating substrate 5 with a bonding agent layer 9. After the semiconductor chip 2 is mounted, a bonding pad 2a of the semiconductor chip 2 is connected to an external guiding lead part 8d with a piece of bonding wire 10. A bonding resin 4 is deposited thereon, and resin packaging is performed. |
