Wafer processing chuck using slanted clamping pins

摘要

A wafer is introduced into a processing chamber on a transport device. Lifting pins receive the wafer from the transport device and lower the wafer to the surface of a chuck. Clamping pins lower and hold the wafer by means of enlargements on the ends of the clamping pins. Grooves on the surface of the chuck and internal channels in the chuck are used to supply gas to the back of the wafer for temperature control.