| 摘要 |
PURPOSE:To improve the heat resistance of a color filter thereby to enable to thermal wire bonding to a spectral function element by using the color filter made of a polyimide resin which contains an organic pigment on the photodetecting surface of a chip element. CONSTITUTION:A chip element 10 on which color filters 3, 4 and 5 made of polymide resin which contains an organic pigment are formed on its photodetecting surface is connected by a thermal wire bonding method to an electric connection member. That is, the polyimide resin has high heat resistance and the organic pigment also has high heat resistance. Accordingly, the heat resistance for the color filters is improved sufficiently to withstand temperature conditions up to approx. 300 deg.C. Thus, it can endure against the working tempera ture conditions of a thermocompression bonding method or other thermal wire bonding method to thermally wire bond the element 10 having the filter. |
