发明名称 Method for soldering a component as well as a printed circuit board having such a component
摘要 Soldering flux rings are pushed onto both limbs on a U-shaped contact link for making through contact on a printed circuit board, which soldering flux rings are seated on conductor tracks on the top of the printed circuit board after the contact links have been inserted. If the printed circuit board is soldered on the rear side by means of wave soldering, then these soldering flux rings melt and solder the contact links on the top of the printed circuit board 1. <IMAGE>
申请公布号 DE3624412(A1) 申请公布日期 1988.01.28
申请号 DE19863624412 申请日期 1986.07.18
申请人 VDO ADOLF SCHINDLING AG 发明人 PFALZGRAF,HELMUT
分类号 H01R12/55;H01R43/02;H01R43/20;H05K3/34;H05K3/40;(IPC1-7):H05K3/34;H01R9/09 主分类号 H01R12/55
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