发明名称 CHEMICAL COPPER PLATING METHOD
摘要 PURPOSE:To prolong the service life of a self-catalyst type chemical copper plating soln. contg. copper oxide as a copper source by regulating the amount of iron in the plating soln. to a specified value or below so as to well maintain the stability of the plating soln. CONSTITUTION:When fine particles of iron oxide are present in a chemical copper plating soln., copper deposits on the fine particles acting as nuclei to make the plating soln. unstable, accordingly it is necessary to make the amount of iron originating in copper oxide as small as possible, and the amount of iron in copper oxide used is regulated to <=1mg/l. It is also necessary to prevent iron from entering the plating soln. by operation in a producing stage. As a result, the stability of the chemical copper plating soln. contg. copper oxide as a copper source is well maintained and the service life can be prolonged.
申请公布号 JPS6314881(A) 申请公布日期 1988.01.22
申请号 JP19860156060 申请日期 1986.07.04
申请人 HITACHI LTD 发明人 MURAKAMI KANJI;AKABOSHI HARUO;KAWAMOTO MINEO;TADOKORO AKIO;NARAHARA TOSHIKAZU
分类号 C23C18/40;H05K3/18 主分类号 C23C18/40
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