Apparatus for aligning wires to solder pads

摘要

A wire guide device includes a base fixture to which a microelectronic component is fixedly attached such that solder pads on the component are exposed. A lacette consisting of a plurality of spaced, upstanding posts is positioned adjacent the microelectronic component such that the posts are aligned with the solder pads. Fine wire is directed around the posts over the solder pads to a wire guide. The wire guide holds each laced wire in position for soldering.