摘要 |
1. Process for producing laminates from at least one layer consisting of a metal M 1 and at least one polyimide layer, directly bonded thereto, by applying a layer of a solution of a polyimide or of a solution of a polyamide-acid, convertible to a polyimide, to a carrier and converting the solution to solid polyimide, characterized in that a carrier is used which consists of a layer of a metal M 1 and a layer, bonded thereto, of a material M 2 different from M 1, the material M 2 having at least one smooth surface on which the layer of metal M 1 is located, which layer has been produced by vapour deposition, printing, knife application or spraying of the metal M 1 in the elemental form on this surface, that the solution of the polyimide or of the polyamide-acid is applied to the exposed surface of the layer of metal M 1, and that, after the conversion of the solution to solid polyimide, the layer of material M 2 is removed. |