发明名称 ROOM TEMPERATURE CURING ORGANOSILOXANE COMPOSITION
摘要 PURPOSE:To provide the title compsn. having excellent heat resistance and releaseability, consisting of a diorganopolysiloxane, a siloxane or silane having hydrolyzable groups, a filler, a curing agent and a specified amide compd. CONSTITUTION:100pts.wt. diorganopolysiloxane (A) having a viscosity of 100-1,000,000cs (25 deg.C), in which both terminals are blocked with hydroxyl groups, is blended with 1-25pts.wt. siloxane or silane (B) having at least three hydrolyzable groups per molecule such as a compd. of formula I or II, 5-300pts. wt. filler (C) (e.g., fumed silica), 0.01-5pts.wt. curing agent (D) (e.g., lead 2- ethyloctoate) and 0.5-10pts.wt. amide compd. (E) of III (wherein R<1> and R<2> are each H or a 1-8C monovalent hydrocarbon group; and R<3> is a 1-8C monovalent hydrocarbon group).
申请公布号 JPS62295958(A) 申请公布日期 1987.12.23
申请号 JP19860137941 申请日期 1986.06.13
申请人 SHIN ETSU CHEM CO LTD 发明人 ARAI MASATOSHI;YOKOO KOJI;KURIHARA YOSHIFUMI
分类号 C08L83/06;C08K5/20;C08K5/5425;C08K5/5465;C08K13/02;C08L83/04;C08L101/02;C09D5/20;H05K3/28;H05K3/34 主分类号 C08L83/06
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