| 摘要 |
PURPOSE:To uniformly process a semiconductor wafer without narrowing a slit nor increasing the depth by forming a semiconductor wafer support in a split structure of a weight support and a gap setter, and point-contacting in a weight. supporting method. CONSTITUTION:Bridges 3b, 3c of the oblique sides of a triangle in which a bridge 3a is of a bottom side are opened outside, and a semiconductor wafer 1 is attached according to the slit of the setter 2a. Then, the bridges 3b, 3c are closed, the setter 2a is so rotated as to be disposed upside, and the wafer 1 is placed on a boat. Since the gap of the wafers 1 is set at one upper position in this manner, the overturn of the wafer 1 in a planar direction can be suppressed to the minimum limit to improve the uniform process in the wafer surface.
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