| 摘要 |
<p>PURPOSE:To prevent remaining of scraps of semiconductors, which are yielded in dividing on the surfaces of the semiconductor elements, and the damage of the surfaces of the semiconductor elements, by covering both surfaces of a semiconductor wafer with flexible sheets, inserting a vacuum sucking needle between the flexible sheets, and evacuating the air in the inside so as to form a vacuum state in the dividing work. CONSTITUTION:A semiconductor wafer 11 to be divided and the tip of a vacuum sucking needle 14 are held with vinyl chloride sheets 12 and 13. The peripheral parts of the sheets 12 and 13 are fixed to a thin rubber plate 16 with a fixing plate 15. Then air is sucked through the sucking needle 14 so as to form i a vacuum state. Then, the sheets 12 and 13 are closely contacted with both surfaces of the wafer 11. Under this state, a manual roller 17 is moved, and the wafer 11 is divided along scribing lines. Then, semiconductor scraps are yielded. Since the sheets 12 and 13 are closely contacted with the surfaces of the wafer, the semiconductor scraps do not damage the surfaces of the semiconductor elements.</p> |
