| 摘要 |
PURPOSE:To enable a cover tape to be easily peeled when a semiconductor device being mounted and improve working property, by forming holes for peeling the cover tape on both edges of the cover tape. CONSTITUTION:A taping member of a semiconductor device 3 is composed of a carrier tape 1 and a cover tape 2. Then, seam-shaped holes 5 for peeling the tape 2 are formed on both edge parts bf the tape 2. In a process in which a housed device 3 is mounted, the device 3 can be taken out by peeling the tape 2 from the holes 5. Scattering of adhesion strength on the thermal pressing joint parts 4 then becomes independent of working property. Hence, the working property can be improved.
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