发明名称 |
INTEGRATED CIRCUIT PACKAGE |
摘要 |
An integrated circuit package in which semiconductor elements mounted on an insulating substrate, ends of lead pieces introduced from the outside and wires that electrically connect them, are accommodated in a cell that is air-tightly defined by the substrate, a cap and a sealing glass. The lead pieces are composed of an alloy having a coefficient of thermal expansion nearly equal to, or smaller than, the coefficient of thermal expansion of the substrate. The alloy is an iron alloy which contains nickel and cobalt, and having a martensite transformation temperture of lower than -55 DEG C. |
申请公布号 |
EP0211618(A3) |
申请公布日期 |
1987.12.16 |
申请号 |
EP19860305894 |
申请日期 |
1986.07.31 |
申请人 |
HITACHI, LTD. |
发明人 |
TSUCHIYA, MASATOSHI;OGIHARA, SATORU;KAGOHARA, HIROMI;OTSUKA, KANJI;OISHI, TOMOJI |
分类号 |
H01L23/057;H01L23/10;H01L23/15;H01L23/495;H01L25/065 |
主分类号 |
H01L23/057 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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