| 摘要 |
PURPOSE:To reduce the inductance in a device itself and a circuit in a stud-type semiconductor device, by forming the shape of an upper electrode constituting as tightly sealed container, which seals a semiconductor element tightly, in a block shape, and using a nonmagnetic material for a compressing member around the electrode. CONSTITUTION:A stud 1 is provided as a lower electrode, which is formed so as to contain a semiconductor element 2 and to surround the side surface of the element 2. An electrode block 3 is provided as an upper electrode, which is mounted on the upper surface of the semiconductor element 2 contained in the stud 21 and constitutes the tightly sealed container. The semiconductor element 2, which is held between the electrode block 3 and the stud 1, is contacted and compressed with a compressing member 5, which is couped with the electrode block 3 and comprises a nonmagnetic material. Both end parts are sealed with a sealing cap 6, which is formed so as to surround the side surfaces between the stud 1 and the electrode block 3, and the semiconductor element 2 is tightly sealed. Thus the inductance in the device itself and the circuit can be reduced.
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