发明名称 SOLDERING INSPECTION DEVICE
摘要 PURPOSE:To obtain the title soldering inspection device having no erroneous recognition between solder and silver by a method wherein the quantity of reflected light generated by silver having a large surface area is made larger than the quantity of reflected light generated by solder by providing a filter part, where transmitted light will be turned to a scattered light around the solder and the silver. CONSTITUTION:The light emitted from an illuminator 10 passes through a semispherical transparent paper 9, it is made to irradiate on a solder 4 and silver 3 as scattered light. Said light emitted from the illuminator 10 is converted into the light directing to various directions by the semispherical transparent paper 9 even when the light is directed to only one direction when it is emitted from the illuminator 10. The quantity of light directed to upward becomes the positive correlation against the surface area of the solder 4 or the silver 3. As there are recesses and protrusions on the surface of the silver 3, the quantity of surface reflected light of the silver 3 exceeds the quantity of surface reflected light of the solder 4. Accordingly, pertaining to the electric signal sent from a camera part 6, the reflected light level of the solder is set at [0] and the reflected light level of the silver is set at [1] by the reference voltage level of the camera interface part 7a as an electric signal distinction part, and the distinction between the solder 4 and the silver 3 can be made by a CPU part 7b.
申请公布号 JPS62282442(A) 申请公布日期 1987.12.08
申请号 JP19860126173 申请日期 1986.05.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORINAGA KAZUNORI
分类号 H01L21/66;G01N21/88;G01N21/956 主分类号 H01L21/66
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