发明名称 Saw device.
摘要 <p>In a SAW device comprising a piezoelectric substrate (1) and at least one set of metallic electrodes (2, 2', 5, 5') formed on the piezoelectric substrate, at least one set of the electrodes have a laminated structure comprised of a layer of an aluminum film added with an impurity at a concentration of 6 wt. % or less and another layer of a film of pure aluminum or aluminum added with an impurity at a concentration of 0.4 wt. % or less. The SAW device having the laminated structure of electrodes can handle high frequency electric signals of higher power and/or larger amplitudes.</p>
申请公布号 EP0246626(A2) 申请公布日期 1987.11.25
申请号 EP19870107300 申请日期 1987.05.19
申请人 HITACHI, LTD. 发明人 YUHARA, AKITSUNA;SASAKI, JUN;HIRASHIMA, TETSUYA;YAMADA, JUN
分类号 H03H3/08;H03H9/02;H03H9/145;(IPC1-7):H03H3/08 主分类号 H03H3/08
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