发明名称 SOLID STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To contrive simplification of constitution of the title device by a method wherein a drain region, connected to the first electrode of a vertical transfer CCD, is provided and a signal charge is discharged to a substrate by utilyzing the punch-through effect between a drain potential well and the substrate or by connecting the drain region and the substrate. CONSTITUTION:When voltage is applied to a transfer gate electrodes 2 and 4, the signal charge accumulated on a photoelectric conversion part 5 is transferred to the potential well 8 located below the transfer electrodes 2 and 4. Then, when voltages phi4-phi1 are applied successively, the signal charge is transferred in the directions of phi4, phi3, #2 and phi1. The signal charge transferred up to the electrode 2, to be used for transfer, passes under the first electrode 1 and reaches a drain 10. As reversely biased voltage drop is applied to between an n-type substrate 9 and the potential well 8, the signal charge reached the drain 10 is made to flow from the bottom of the drain 10 to the n-type substrate 9 and discharged.
申请公布号 JPS62265757(A) 申请公布日期 1987.11.18
申请号 JP19860108623 申请日期 1986.05.14
申请人 MATSUSHITA ELECTRONICS CORP 发明人 NOBUSADA SHIYUNEI;KURODA TAKAO;HORII SAKAKI
分类号 H01L29/762;H01L21/339;H01L27/148;H01L29/76;H01L29/772;H04N5/335;H04N5/341;H04N5/359;H04N5/369;H04N5/372 主分类号 H01L29/762
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