| 摘要 |
PURPOSE:To simply perform a sealing operation at low cost by a method wherein the mold having the mirror face consisting of the material non-adhesive to the poured transparent resin covering a photoelectric conversion element is positioned in such a manner that the mirror face is pushed against and comes in contact with the photo signal incident plane of the transparent resin, and the mold is exfoliated after the resin has been hardened. CONSTITUTION:The photoelectric conversion element 1 of an insulating substrate 6 is wire-bonded by performing a wire-bonding, and transparent resin 7 is poured on the photoelectric conversion element 1 until a wire 8 will be completely hidden using a dispenser and the like. Then, the spacer 9 is placed on the substrate 6 in such a manner that it does not come in contact with the transparent resin, and when the mold 11 having the mirror face 10, consisting of the material which is non-adhesive to the transparent resin 7, is placed on the spacer 9 in such a manner that the mirror face 10 comes in contact with the transparent resin 7, the transparent resin 7 is tightly adhered to the mirror face 10 by surface tension. Then, the transparent resin 7 is hardened, and when the mold 11 and the spacer 9 are removed, the photosignal incident plane 12 of the transparent resin 7 is turned to the state of mirror face. Accordingly, the photoelectric conversion element 1 can be simply sealed at low cost without using glass. |
