| 摘要 |
PURPOSE:To facilitate replacement of semiconductor elements and to make the device compact, by aligning the semiconductor elements, in each of which the cooling part of a heat sink is brought into contact with an electrode, on a mounting stage. CONSTITUTION:The cooling parts of first liquid cooling heat sinks 2a-2c on one side are brought into contact with the electrodes of semiconductor elements 1b and 1c on one side, which are connected to each other. The cooling parts of the first liquid cooling heat sinks 2a-2c on the other side are brought into contact with the other electrodes of the semiconductor elements. Second liquid cooling heat sinks 3a and 3b are electrically brought into contact with the electrodes of semiconductor elements 1a and 1d at the ends. The semiconductor element and the cooling part are laminated for every semiconductor element so as to form a unitary body. A resistor 10 of a voltage divider circuit is brought into contact with each cooling part at the top of the laminated layer of the semiconductor element and the cooling part. Thus, a liquid cooling heat sink for cooling only the resistor can be omitted. The number of pieces of insulating pipes 6 is decreased. Thus, the device is made compact, and reliability is improved. |
