| 摘要 |
PURPOSE:To obtain the titled resin composition excellent in cracking resistance, moisture resistance, etc., by mixing a specified alkylbenzene-modified phenolic novolak epoxy resin as at least part of the epoxy resin to be used with a curing agent, a filler, etc. CONSTITUTION:A phenol (A) (e.g., phenol or resorcinol) is condensed with 20-60wt% alkylbenzene (B) (e.g., toluene or naphthalene) and formaldehyde (C). The formed cocondensate is epoxidized to produce an alkylbenzene-modified phenolic novolak epoxy resin of formula I (wherein R1 is H, CH3 or OH, R2 is a group of formula II, III, IV or V and m and n are each 0-3). This resin used as at least part of the epoxy resin to be used is mixed with a curing agent, a cure accelerator, a filler, a mold release, a surface-treating agent, etc. to obtain the purpose epoxy resin composition suitable for the production of electronic devices, etc.
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