发明名称 INORGANIC FILLER AND RESIN COMPOSITION CONTAINING IF FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To obtain an inorganic filler giving excellent adhesive properties when used in a reactive adhesive, by adjusting the concentration of hydroxyl groups present on the surface of the inorganic filler to a specific level. CONSTITUTION:The concon. of hydroxyl groups present on the surface of an inorganic filler is adjusted to 5-25mug. equivalent/m<2>. As the method for adjusting the concn. of hydroxyl groups on the surface of the inorganic filler, a method comprising increasing the concn. of hydroxyl groups from a lower concn. side, a method comprising decreasing the concn. from a higher concn. side, and a method comprising a combination of the two methods can be mentioned. In all cases, it is necessary not to spoil the essential characteristics of the filler caused by incorporation of an impurity and so on. As the methods for increasing the hydroxyl groups, a high-temp. steaming treatment, a treatment with an acid such as HF and so on, and a treatment with a base such a NaOH and so on can be listed. As the methods for degrasing the hydroxy groups, a backing treatment in a low-pressure steam, a reaction with ClSi (SH3)3, CH2N2, alcohol and so on can be listed.
申请公布号 JPS62246943(A) 申请公布日期 1987.10.28
申请号 JP19860090115 申请日期 1986.04.21
申请人 DENKI KAGAKU KOGYO KK 发明人 KIMURA YOSHIO;CHIBA TAKASHI
分类号 C08K3/00;C08K9/00;C08K9/04;C08L101/00 主分类号 C08K3/00
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