| 摘要 |
<p>PURPOSE:To obtain the titled resin with reduced mold wear in sealing and enhanced heat dissipation of sealed semiconductor devices, outstanding in moisture resistance, for use as epoxy mold resin for low-pressure transfer molding, by incorporating a resin with, as a filler component, spherical alumina powder. CONSTITUTION:The objective resin can be obtained by incorporating a resin such as epoxy resin with, as a filler component, spherical alumina powder (e.g. with an average size 10-20mum).</p> |
