| 摘要 |
PURPOSE:To unseal a sealing resin easily without damaging a lead, and to analyze the cause of trouble to a high degree by forming the thickness of the resin on a semiconductor chip in size thinner than that of other sections. CONSTITUTION:A semiconductor chip 2 is fixed onto an island 1 for a lead frame by a solder material such as Au or silver paste, and bonded with bonding pads for the semiconductor chip and leads 4 by using small-gage wires 3 consisting of Au or Al, the lead frame is set to a sealing mold with a projecting section in a corresponding section on the surface of the semiconductor chip, and a sealing resin 5 such as epoxy or silicone is caused to flow to seal the lead frame. When external leads for the lead frame are cut and molded, the sealing resin on the surface can be made thinner than other sections. Accordingly, mechanical stress due to the difference of the thermal expansion coefficients of the sealing resin 5 and the semiconductor chip 2 can be relaxed, and the surface of the semiconductor chip can be exposed without breaking the lead sections. |
