发明名称 CURING AGENT COMPOSITION
摘要 PURPOSE:To obtain a curing agent composition which is lowly toxic, can show an excellent curing rate at low temperature and can give a cured epoxy resin of good properties, by mixing an aromatic diamine with monochloro-p- phenylenediamine and a specified compound. CONSTITUTION:A curing agent composition obtained by mixing 100pts.wt. total of 100pts.wt. aromatic diamine of formula I or II [wherein R1-4 are each CH3, C2H5, C3H7, CH(CH3)2 or C4H9, R6-7 are each CH3, C2H5 or C3H7] and 10-900 pts.wt. monochloro-p-phenylenediamine (B) with 2-40pts.wt. at least one compound (C) selected from among salicylic acid, benzoic anhydride and BF3 or its alkylamine complex or acetic acid complex and melt-kneading the mixture. Said curing agent composition is added to an epoxy resin at an equivalent ratio of the epoxy resin to the amine of 0.7-1.3, and the resin is cured by heating to 5-100 deg.C.
申请公布号 JPS62232429(A) 申请公布日期 1987.10.12
申请号 JP19860075601 申请日期 1986.04.03
申请人 NIPPON KAYAKU CO LTD 发明人 ISHII SHIGERU;NAKANO YASUO
分类号 C08G59/50 主分类号 C08G59/50
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