发明名称 METHOD OF PATTERN EMBOSSING TO SYNTHETIC RESIN MOLDED ITEM AND APPARATUS THEREFOR
摘要 PURPOSE:To make it possible to correctly remove an inside punched-out portion by suction with a simple mechanism by a method wherein the inside punched-out portion in the plane of pattern is repeatedly pulled by being sucked by the center mold of a die. CONSTITUTION:A freely ventilative center mold 13 is arranged vertically movably in the interior of a die 10 having a pressing surface 11 with the same shape as embossing pattern. A sucking device 15 to act the air pressure on the center mold 13 is connected to the center mold 13. An inside punched-out portion S2, which is fusion-welded by being punched by pressing to a thermoplastic synthetic resin molded item W main body so as to be flush with the item W, is attracted to the end face of the center mold 13 by means of the air pressure of the sucking device 15. Next, when the inside punched-out portion S2 is repeatedly attracted to a vent face 12, the repeated attraction gradually enlarges melt down portion until even the portion, which does not attract at the initial stage, can be fully attracted and consequently the inside punched-out portion S2 can correctly be removed with a simple mechanism.
申请公布号 JPS62227628(A) 申请公布日期 1987.10.06
申请号 JP19860070066 申请日期 1986.03.28
申请人 HASHIMOTO FORMING CO LTD 发明人 TAMURA TATSUYA
分类号 B29C65/02 主分类号 B29C65/02
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