发明名称 PHOTOSENSITIVE COMPOSITION
摘要 PURPOSE:To obtain a photosensitive compsn. having superior heat resistance, RIE resistance and definition and wide latitude of development of resist pattern with alkali permitting formation of fine resist pattern by constituting a photosensitive compsn. of a compd. contg. a polymer having a specified structure unit and a photosensitive compd. CONSTITUTION:A photosensitive compsn. consists of a resin contg. a polymer having structural units expressed by the formula I or II and a structural unit expressed by the formula III, having 10<3>-10<5> number average mol.wt. of the resin and a photosensitive compd. The content of the polymers expressed by the formulas I, II, and III is 10-100wt%. The number average mol.wt. of the constitutional component contg. the polymer is particularly preferred to be 2,000-60,000. Either a positive photosensitive compd. or a negative photosensitive compd. may be usable as the photosensitive compd. In the formulas, R1 and R5 may be same or different atom expressing halogen atom, etc.; R6 is alkyl group, etc.; R7 and R11 may be same or different atom expressing H atom, etc.
申请公布号 JPS62227143(A) 申请公布日期 1987.10.06
申请号 JP19860068803 申请日期 1986.03.28
申请人 TOSHIBA CORP 发明人 ONISHI KIYONOBU;HORIGUCHI RUMIKO;HAYASE SHUJI
分类号 G03C1/00;G03C1/72;G03F7/00;G03F7/012;G03F7/021;G03F7/023;G03F7/032;G03F7/038 主分类号 G03C1/00
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